JPS635227Y2 - - Google Patents

Info

Publication number
JPS635227Y2
JPS635227Y2 JP1982101872U JP10187282U JPS635227Y2 JP S635227 Y2 JPS635227 Y2 JP S635227Y2 JP 1982101872 U JP1982101872 U JP 1982101872U JP 10187282 U JP10187282 U JP 10187282U JP S635227 Y2 JPS635227 Y2 JP S635227Y2
Authority
JP
Japan
Prior art keywords
mold
resin material
plunger
upper mold
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982101872U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5887337U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10187282U priority Critical patent/JPS5887337U/ja
Publication of JPS5887337U publication Critical patent/JPS5887337U/ja
Application granted granted Critical
Publication of JPS635227Y2 publication Critical patent/JPS635227Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10187282U 1982-07-05 1982-07-05 半導体樹脂封入成形用金型装置 Granted JPS5887337U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10187282U JPS5887337U (ja) 1982-07-05 1982-07-05 半導体樹脂封入成形用金型装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10187282U JPS5887337U (ja) 1982-07-05 1982-07-05 半導体樹脂封入成形用金型装置

Publications (2)

Publication Number Publication Date
JPS5887337U JPS5887337U (ja) 1983-06-14
JPS635227Y2 true JPS635227Y2 (en]) 1988-02-12

Family

ID=29896530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10187282U Granted JPS5887337U (ja) 1982-07-05 1982-07-05 半導体樹脂封入成形用金型装置

Country Status (1)

Country Link
JP (1) JPS5887337U (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS5850582B2 (ja) * 1979-08-24 1983-11-11 道男 長田 半導体封入成形方法とその金型装置
JPS57123222U (en]) * 1981-01-26 1982-07-31

Also Published As

Publication number Publication date
JPS5887337U (ja) 1983-06-14

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